Advanced Designer Certification (CID+)
Course Objectives

Layout

• Design standards to meet fabrication and assembly goals
• Material list development
• Panelization strategy for mfg processes
• Individual board tooling considerations
• Blind and Buried via strategy development
• Layout approaches for crosstalk minimization
• Power and ground routing techniques

Materials & Components

• Board Material Properties
• Plating Characteristics for Conductors and Holes
• Surface Finish Characteristics and Usage
• Solder Masks/Coating Material Properties and Compatibility
• Component Comparison Between Area Array and Peripheral
• Component Mounting Strategies
• Non-Standard Mechanical Outline (Case) Integration

Electrical Considerations

• Electrical Clearance and Dielectric Spacing
• Conductor carrying capacity verses temperature rise
• General Principles of impedance control
• Shielding Requirements to Prevent Signal Emissions

Assembly requirements

• Component Mounting Shock and Vibration Requirements
• Component Assembly Strategy and Sequence Analysis
• Evaluation of Component Attachment Methods
• Tools and Techniques for Assembly Repair & Modification

Board Fabrication

• Copper balanced effects on printed board fabrication
• Fabrication equipment board size limitation
• Board from panel excising requirements
• Printed board lenght to width relationships

Physical board characteristics

• Printed Board Thermal Management Techniques
• Physical Board Dielectric Parameters
• Homogenous Material Performance Capability
• Controlled Expansion Constructions Using Special Cores

Documentation

• Printed Board Tolerance Analysis (Manual vs Automated)
• Standardization of Data Formats for Printed Board & Assembly
• Documentation to Facilitate Design to Fabrication Interface

Reliability

• Highly Accelerated Stress Test Evaluations
• Signal Integrity Analysis
• Test Evaluations for EMI Susceptibility/Radiation
• Tools and Management Techniques for Quality Traceability

Inspection and test

• Assembly Test Implementation (Self Test, Functional, Nodal)
• Test Point/Land Pattern Feature Differentiation
• In-Process Test Coupons